Kuyini i-electroplating?
Ngamagama alula, i-electroplating ibhekisela ekuphenduleni kwe-electrolytic esixazululweni ngosizo lwamanje oluqondile lwangaphandle ukufaka ungqimba lwensimbi noma i-alloy ebusweni bomqhubi njengensimbi.
Okubizwa ngokuthi ukusabela kwe-electrolytic kubhekisela "ekusetshenzisweni kwamanje okugxilile ukuze kubangele ukusabela kwe-REDOX okungazenzeki".
Into ehlanjululwe phezulu ingaba yinsimbi (njengensimbi) noma engeyona insimbi (njengepulasitiki).
Izinhlobo zokwelashwa kwendawo:
I-Plate, i-Electroplating, i-Auto-catalytic Plating, i-Chemical Plating, i-Electroless Plating, i-Electroless Plating, i-Anodizing, i-Chemical Conversion Coating, i-Blackening, i-Phosphating, i-Chromating, i-Metal Colouring, i-Paint Finishing, i-Hot dip (I-Galvanizing, i-Plating, i-Plating ,Iyoni I-Plating, I-Chemical Vapor Deposition...
Izinqubo ze-electroplating:
Ukwelashwa Ngaphambili:
Ngaphambi kokucwenga, ingaphezulu le-plating, njengamafutha noma uthuli kufanele lihlanzwe kahle. Isigaba sokwelashwa sangaphambi kokwelashwa ngokuvamile sihlanganisa ukusetshenziswa kokukhishwa kwe-alkaline kwasekuqaleni, ukuncishiswa kukagesi nokucosha ukuze kukhishwe uqweqwe nokugqwala, nezinye izindlela zokuvula indawo engaphezulu. Inqubo yomuntu ngamunye yokwelashwa kwangaphambili yakhelwe ngokuya ngohlobo lwe-plating kanye nenqubo yokucwenga elandelayo. Ngaphezu kwalokho, ezinye izingxenye zokucwenga njenge-aluminium, insimbi engagqwali noma iglue ye-ABS zidinga ukunakekelwa okuthile okukhethekile.
I-Hot-dip degreasing:
Ngokuyinhloko ukusetshenziswa kwe-alkali kanye ne-saponification kawoyela we-saponification ukususa ukungcola okungaphezulu kwensimbi nama-oxides, okumele kube nemiphumela yokumanzisa, ukungena, ukuhlakazeka kanye ne-emulsification.
Ama-agent asetshenziswa kakhulu: i-sodium hydroxide, i-sodium carbonate, i-sodium bicarbonate, i-sodium phosphate, i-trisodium phosphate, i-sodium pyrophosphate, i-gluconate ne-silicate, njll. Nokho, ngenxa yezinkinga zemvelo, uhlelo lwe-phosphate luzoqedwa kancane kancane. Ikakhulukazi isebenzisa amandla e-alkali ukuze ifake kuma-substrates ahlukene.
Okubizwa ngokuthi i-interface esebenzayo i-ejenti esebenzayo i-emulsifier, ingahlukaniswa ibe yi-cationic, i-anionic, i-cationic ne-non-ionic interface esebenzayo i-agent esebenzayo. Kufanele ibe nomthelela wokuhlakazeka kanye ne-emulsification, igweme ukuntanta kwamafutha endaweni ephathwayo, inciphise ukususwa, futhi inciphise inkathazo yokugeza okulandelayo.
I-Electrolytic degreasing:
Ngenxa ye-electrolysis, i-cathode ikhiqiza i-hydrogen ukunciphisa insimbi (i-stainless steel plate), futhi i-anode ikhiqiza umoya-mpilo futhi i-oxidizes ukungcola (izingxenye); Igesi ishayela isenzo esinyakazayo futhi ikhiphe ukungcola. Umsebenzi we-lye ukwenza i-saponify amafutha. Kodwa-ke, i-cathode ingase ikhiqize i-hydrogenation yezinto ezibonakalayo, ukuphambuka kwamanje kukhiqiza imiphumela ehlukene yokunciphisa amafutha, futhi igesi kanye nenkungu ewuketshezi ekhiqizwa ngesikhathi esifanayo ibangela izingozi zomphakathi kanye nezingozi zokuqhuma, okufanele kucatshangelwe uma usebenzisa.
Njengamanje, ukukhishwa kwe-hot-dip degreasing kanye ne-electrolytic degreasing kusetshenziswa ndawonye. Izinga le-electroplating lihle noma libi, ama-50% ancike ekwelashweni kwangaphambili.
Ukwenza kusebenze:
Ukwenziwa kusebenze kwe-substrate okujwayelekile kwaziwa nangokuthi i-picling, i-acid neutralization noma i-etching, kuye ngomkhiqizo nezinto eziphathwayo. Ingakwazi ukususa i-oxide nosawoti endaweni yensimbi, ukuze kube lula ukuvala insimbi ye-electroplating elandelayo. Kodwa-ke, kuyadingeka ukukhetha ngokucophelela i-asidi efanelekile kanye ne-corrosion inhibitor ukugwema ukuguguleka ngokweqile kwe-substrate, okuholela ezinkingeni ezilandelayo ze-electroplating.
I-Electroplating:
I-Electroplating inqubo yokufaka ungqimba oluncane lwensimbi ebusweni bomqhubi ukuhlobisa ukucwenga noma ukuvimbela ukugqwala. I-electroplating yensimbi evamile e-Hong Kong ihlanganisa i-nickel, ithusi, ithusi, i-chromium, i-zinc, isiliva negolide. Ngaphezu kwe-electroplating, ukwelashwa okujwayelekile kwendawo yensimbi i-electroplating, i-anodizing kanye nokudweba.
I-Copper Plating:
Ikakhulukazi kubhavu we-cyanide, okugeza nge-sulfuric acid kanye ne-pyrophosphoric acid okugeza. Ibhavu le-cyanide lilungele insimbi ne-zinc alloy substrate plating. Nge-ejenti ye-gloss efanelekile, ukunamathela okucwebezelayo okubushelelezi kungatholakala. Ukufana kwe-coating muhle, ukuzinza kwesisombululo se-plating sekusetshenziswe iminyaka eminingi, kodwa isixazululo sokucwenga siqukethe ubuthi obuningi be-cyanide, izindleko eziphakeme zokuhlanza amanzi angcolile, ngaphezu kokufakwa kwe-roll kanye nokufakwa ngaphambilini kuye kwashintshwa kancane kancane.
Ukugeza kwe-Sulfuric acid enezithasiselo ezifanele, ukugcwaliswa okuphezulu kanye ne-gloss, izindleko eziphansi, ukuphathwa okulula, izindleko eziphansi zokwelashwa kwamanzi angcolile, sekusetshenziswe kabanzi kumabhodi wesifunda, imihlobiso, i-electroforming kanye neminye imikhakha.
Ukugeza kwe-pyrophosphoric acid enezithako ezifanele. Isetshenziswa kumabhodi wesekethe. Kodwa-ke, ukwelashwa kwamanzi angcolile kuyakhathaza, ngaphezu kwe-zinc alloy bottom plating, okuzothathelwa indawo ukugeza kwe-sulfuric acid.
I-Nickel Plating:
Ikakhulukazi i-sulfuric acid okugeza, ukugeza kwe-Vaz njengommeleli wayo, izindleko eziphansi zesisombululo sokucwenga, ukuphathwa okulula, okusetshenziselwa izinjongo ezihlukahlukene zezimboni nezokuhlobisa, izingxenye ze-electronic kanye nezidingo ze-electroforming, ukugeza kwe-sulfenic acid nokucindezeleka okuphansi, i-ductility ephezulu, ukubekwa uphawu okungcono. kanye nefomula yokugxila ephezulu, ithathe indawo yokugeza nge-sulfuric acid.
Izici zokucwebezela kanye nokucaba kwe-nickel coating ikakhulukazi zincike ezithasiselweni ze-nickel.
Izithasiselo ezijwayelekile zokuhlanganisa i-nickel zingahlukaniswa zibe BRIGHTENER, CARRIER kanye ne-WETTING ejenti. Ukuvama kanye nenani loketshezi okwengezwe kuncike ekuqineni kwe-substrate, ukushuba okufunayo, kanye nokucwebezela okudingekayo kanye nokucaba. Isixazululo se-plating kufanele sihlaziywe futhi sengezwe njalo ukuze kugcinwe ukugxila okuphumelelayo kwengxenye ngayinye kusixazululo sokugqoka ukuze kugcinwe ikhwalithi yokugqoka.
I-Gild:
Ikakhulukazi ekugezeni kwe-cyanide, ihlukaniswe yaba yi-alkaline, hlangothi kanye ne-acidic. Ngaphezu kwe-ion yegolide (evame ukubizwa ngokuthi usawoti wegolide), isixazululo se-plating kufanele sibe nosawoti oqhubayo, usawoti ophethe kahle (i-buffer salt), i-gloss agent; Ngaphezu kwalokho, i-agent ye-gloss ingahlukaniswa ibe izithasiselo ze-organic kanye ne-alloy.
Usawoti wegolide: i-cyanide potassium yegolide, ukuhlinzeka ngesengezo semvula yegolide, ngakho-ke lapho i-golden-plated, i-anode ivamise ukuba yi-anode ebuthuntu.
Usawoti we-conductive: uhlinzeka ngomphumela we-conductive kusisombululo sokucwenga.
I-Balanced conductive salt: ukunikeza ibhalansi ye-acid-base kubhavu, umphumela wokuqhuba.
I-gloss agent (organic): ukuhlinzeka ngokucwebezela kanye nokucaba.
I-gloss ejenti (ingxubevange) : inikeza ukushintsha kombala, ubulukhuni bokusetshenziswa.
I-homogeneity yokugeza kwe-alkaline yinhle, futhi akulula ukwenza i-eutectoid ngokungcola okufana nensimbi. Ukugeza okungathathi hlangothi kungenziwa nge-eutectosed ukwenza i-alloy coating. Ukugeza kwe-Acid nakho kungakha i-alloy coating, i-plating ewugqinsi, enempahla yokuvala engcono, ukuqina nokumelana nokugqoka kuhle kakhulu, kulungele ikakhulukazi izidingo zezingxenye ze-elekthronikhi.
Ukucubungula ngemuva:
Umsebenzi oyinhloko we-post-treatment ukomisa i-plating futhi wenze ukuhlolwa kokugcina. Kwezinye izimo, i-workpiece idinga ukuguqulwa noma ukupeyintwa ngemva kwe-electroplating ukuze inikeze isendlalelo sokuzivikela.
Ukwelashwa kwefilimu futhi kuyinketho yokugcina ukunamathela kumelana nokuguquguquka nokuguguleka ekungcoleni kwemvelo. Nokho, ukunakekelwa kufanele kuthathwe ukuze kugwenywe ubunzima ekwelashweni okulandelayo. Abaningi post-ukucutshungulwa, kumele bamukele usawoti spray, base acid, izinga lokushisa eliphezulu kanye nezinye izivivinyo, ikakhulukazi imikhiqizo eyigugu metal, izidingo ngokuya eqinile.
Hlanza:
Ukuhlanza kuyindlela edinga amanzi kakhulu ekukhiqizeni i-electroplating. Ngemva kwethangi lokucwenga ngalinye, kuvame ukuba nesethi yezinqubo zokugeza ukuvimbela izingxenye zokucwenga ekuthwaleni uketshezi olusele kwezinye izinqubo futhi kubangele ukungcoliswa.
