Yintoni i-electroplating?
Ngamagama alula, i-electroplating ibhekisela kwimpendulo ye-electrolytic kwisisombululo ngoncedo lwangoku lwangaphandle oluthe ngqo ukubeka isinyithi okanye i-alloy layer ebusweni bomqhubi njengentsimbi.
Into ebizwa ngokuba yi-electrolytic reaction ibhekiselele "kusetyenziso lwe-impressed yangoku ukuze kubangele ukusabela kweREDOX okungaqhelekanga".
Into ephathwayo ebusweni ingaba yintsimbi (efana nentsimbi) okanye engeyiyo isinyithi (njengeplastiki).
Iindidi zonyango olungaphezulu:
ukuPlating,Electroplating,Auto-catalytic Plating,Chemical Plating,Electroless Plating,Electroless Plating,Anodizing,Chemical Conversion Coating,Blackening,Phosphating,Chromating,Metal Colouring,Ukugqitywa kwePeyinti,Idiphu eshushu (iGalvanizing, ukuPlalika, ukuPlalika ,Iyoni Ukucwenga, ukuBekwa komphunga weChemical...
Iinkqubo ze-electroplating:
Unyango lwangaphambili:
Ngaphambi kokutyalwa, umphezulu we-plating, njengegrisi okanye uthuli kufuneka ucocwe ngokufanelekileyo. Inqanaba lonyango lwangaphambili ngokuqhelekileyo libandakanya ukusetyenziswa kwe-alkaline yokuqala yokuchithwa, ukuchithwa kombane kunye nokucholwa ukususa i-rind kunye ne-rust, kunye nezinye iindlela zokuvula umphezulu. Inkqubo yonyango yangaphambi konyango yenzelwe ngokohlobo lwe-plating kunye nenkqubo yokucwenga elandelayo. Ukongeza, ezinye iindawo zokubeka ezifana ne-aluminium, intsimbi engatyiwa okanye iglu ye-ABS zifuna unyango olukhethekileyo.
Ukususa igrisi kwidiphu eshushu:
Ikakhulu kukusetyenziswa kwe-alkali kunye ne-saponification ye-oyile ye-saponification ukususa ukungcola komhlaba wesinyithi kunye ne-oxides, ekufuneka ibe neziphumo zokumanzisa, ukungena, ukusasazeka kunye ne-emulsification.
Iiarhente ezisetyenziswa ngokuqhelekileyo: i-sodium hydroxide, i-sodium carbonate, i-sodium bicarbonate, i-sodium phosphate, i-trisodium phosphate, i-sodium pyrophosphate, i-gluconate kunye ne-silicate, njl. Nangona kunjalo, ngenxa yeengxaki zokusingqongileyo, inkqubo ye-phosphate iya kupheliswa ngokuthe ngcembe. Ikakhulu isebenzisa amandla e-alkaline ukugalela kwii-substrates ezahlukeneyo.
Into ebizwa ngokuba yi-agent esebenzayo ye-interface yi-emulsifier, inokwahlulwa ibe yi-cationic, i-anionic, i-cationic kunye ne-non-ionic interface esebenzayo. Kufuneka ibe nefuthe lokusasazwa kunye ne-emulsification, ugweme ioli edadayo kwindawo ephathwayo, ukunciphisa ukususwa, kunye nokunciphisa inkathazo yokuhlamba okulandelayo.
Electrolytic degreasing:
Ngenxa ye-electrolysis, i-cathode ivelisa i-hydrogen ukunciphisa isinyithi (i-plate yensimbi engenasici), kwaye i-anode ivelisa i-oksijeni kwaye i-oxidizes ukungcola (iinxalenye); Irhasi iqhuba isenzo esishukumisayo kwaye ikhuphe ukungcola. Umsebenzi we-lye ku-saponify ioli. Nangona kunjalo, i-cathode inokuvelisa i-hydrogenation yezinto, ukutenxa kwangoku kuvelisa iziphumo ezahlukeneyo zokunciphisa, kunye nerhasi kunye nenkungu engamanzi eveliswa ngaxeshanye ibangele iingozi zoluntu kunye neengozi zokuqhuma, ekufuneka ziqwalaselwe xa usebenzisa.
Okwangoku, i-hot-dip degreasing kunye ne-electrolytic degreasing zisetyenziswa kunye. Umgangatho we-electroplating ulungile okanye umbi, i-50% ixhomekeke kunyango lwangaphambili.
Ukuqaliswa:
Ukusebenza kwe-substrate ngokubanzi kwaziwa ngokuba yi-pickling, i-asidi neutralization okanye i-etching, ngokuxhomekeke kwimveliso kunye nezinto eziphathwayo. Iyakwazi ukususa i-oxide kunye netyuwa kwindawo yesinyithi, ukwenzela ukuba i-metal surface ibe lula ukuvala kunye ne-electroplating metal elandelayo. Nangona kunjalo, kuyimfuneko ukukhetha ngokucophelela i-asidi efanelekileyo kunye ne-corrosion inhibitor ukuze ugweme ukukhukuliseka okugqithiseleyo kwe-substrate, okubangelwa iingxaki ze-electroplating ezilandelayo.
Electroplating:
I-Electroplating yinkqubo yokubeka umaleko obhityileyo wesinyithi kumphezulu womqhubi ukuhlobisa i-plating okanye ukuthintela umhlwa. I-electroplating yentsimbi eqhelekileyo eHong Kong ibandakanya i-nickel, ubhedu, ubhedu, ichromium, i-zinc, isilivere negolide. Ukongeza kwi-electroplating, unyango oluqhelekileyo lomphezulu wesinyithi yi-electroplating, i-anodizing kunye nepeyinti.
Ukucwenga ubhedu:
Ikakhulu kwibhafu yecyanide, i-sulfuric acid bath kunye ne-pyrophosphoric acid bath. Ibhafu ye-cyanide ifanelekile kwi-iron kunye ne-zinc alloy substrate plating. Nge-agent yeglosi efanelekileyo, i-gloss coating egudileyo inokufumaneka. Ukufana kokwambathisa kulungile, ukuzinza kwesisombululo se-plating kusetyenziswe iminyaka emininzi, kodwa isisombululo se-plating sinetyhefu eninzi ye-cyanide, iindleko eziphezulu zokucocwa kwamanzi amdaka, ukongeza kwi-roll plating kunye nokufakwa kwangaphambili kuthatyathelwe indawo ngokuthe ngcembe.
Ukuhlamba i-asidi ye-sulfuric enezongezo ezifanelekileyo, ukuzaliswa okuphezulu kunye ne-gloss, ixabiso eliphantsi, ulawulo olulula, ixabiso eliphantsi lokunyanga kwamanzi amdaka, lisetyenziswe ngokubanzi kwiibhodi zeesekethe, imihlobiso, i-electroforming kunye nezinye iindawo.
Ibhafu ye-Pyrophosphoric acid enezongezo ezifanelekileyo. Isetyenziswe kwiibhodi zeesekethe. Nangona kunjalo, unyango lwamanzi amdaka luyinkathazo, ukongeza kwi-zinc alloy bottom plating, ukuba ithatyathelwe indawo yi-sulfuric acid bath.
I-Nickel plating:
Ikakhulu i-sulfuric acid bath, i-Vaz bath njengommeli wayo, ixabiso eliphantsi lesisombululo se-plating, ulawulo olulula, olusetyenziswa ngokubanzi kwiinjongo zoshishino kunye nokuhombisa, kwiindawo ze-elektroniki kunye neemfuno ze-electroforming, i-sulfenic acid bath kunye noxinzelelo oluphantsi, i-ductility ephezulu, ukutywinwa okungcono. kunye nefomula yoxinaniso oluphezulu, ithathe indawo yokuhlamba ngeasidi yesulfuric.
Iimpawu zegloss kunye ne-flatness ye-nickel coating ikakhulu zixhomekeke kwizongezo ze-nickel.
Izongezo ze-nickel plating ngokubanzi zinokuhlulwa zibe BRIGHTENER, CARRIER kunye ne-WETTING agent. Ubuninzi kunye nomthamo wolwelo olongeziweyo kuxhomekeke kuburhabaxa be-substrate, ubukhulu obufunwayo, kunye neglosi efunekayo kunye nokucaba. Isisombululo se-plating kufuneka sihlalutywe kwaye songezelelwe rhoqo ukuze kugcinwe ugxininiso olusebenzayo lwecandelo ngalinye kwisisombululo sokucoca ukugcina umgangatho wokugquma.
Gild:
Ikakhulu kwibhafu ye-cyanide, ihlulwe ibe yi-alkaline, ingathathi hlangothi kunye ne-acidic. Ukongeza kwi-ion zegolide (eyaziwa ngokuba yityuwa yegolide), isisombululo se-plating kufuneka sibe netyuwa eqhubayo, ityuwa edibeneyo (ityuwa ye-buffer), i-agent yeglosi; Ukongezelela, i-agent ye-gloss inokwahlulwa ibe yi-organic and alloy additives.
Ityuwa yegolide: igolide ye-cyanide potassium, ukubonelela ngesongezelelo semvula yegolide, ngoko xa i-gold-plated, i-anode idla ngokuba yi-anode ebuthuntu.
Ityuwa eqhubayo: ibonelela ngesiphumo sokuqhuba kwisisombululo seplating.
Ityuwa ye-Balanced conductive: ukubonelela nge-acid-base balance in the bath, i-conductive effect.
I-agent ecwebezelayo (organic) : ukubonelela ngeglosi kunye nokukhanya.
I-agent yeglosi (i-alloy) : ibonelela ngotshintsho lombala, ubunzima bokusetyenziswa.
I-homogeneity yokuhlamba i-alkaline ilungile, kwaye akulula ukuba i-eutectoid ngokungcola okufana nentsimbi. Ukuhlamba okungathathi hlangothi kunokukhutshwa kwi-eutectosed ukwenza i-alloy coating. Ibhafu ye-Acid inokwenza i-alloy coating, i-alloy plating, enepropathi engcono yokutywina, ukuqina kunye nokumelana nokunxiba kugqwesileyo, ngakumbi kufanelekile kwiimfuno zamalungu e-elektroniki.
Ukusetyenzwa ngasemva:
Umsebenzi oyintloko wokunyanga emva kokunyanga kukumisa i-plating kwaye wenze uhlolo lokugqibela. Kwezinye iimeko, i-workpiece kufuneka iguqulwe okanye ipeyintiwe emva kwe-electroplating ukubonelela ngoluhlu olukhuselayo.
Unyango lwefilimu lukwayindlela yokugcina i-coating ixhathisa ukuguga kunye nokukhukuliseka kungcoliseko lokusingqongileyo. Nangona kunjalo, kufuneka kuthathelwe ingqalelo ukuphepha ubunzima kunyango olulandelayo. Uninzi lwe-post-processing, kufuneka lwamkele isitshizi setyuwa, isiseko se-asidi, ubushushu obuphezulu kunye nezinye iimvavanyo, ngokukodwa iimveliso zentsimbi ezixabisekileyo, iimfuno ziya zisiba nzima.
Coca:
Ukucoca yeyona nkqubo yamanzi kakhulu kwimveliso ye-electroplating. Emva kwetanki yokucwenga nganye, kudla ngokubakho iseti yeenkqubo zokuvasa ukuthintela iindawo zokugquma ekuthwaleni ulwelo olushiyekileyo kwezinye iinkqubo kwaye zibangele ungcoliseko.
