electroplating yog dab tsi?
Hauv cov ntsiab lus yooj yim, electroplating yog hais txog cov tshuaj tiv thaiv electrolytic hauv kev daws teeb meem nrog kev pab los ntawm cov khoom siv hluav taws xob sab nraud kom tso cov hlau lossis hlau txheej rau ntawm qhov chaw ntawm tus neeg xyuas pib xws li hlau.
Lub npe hu ua electrolytic cov tshuaj tiv thaiv yog hais txog "kev siv cov impressed tam sim no los ua cov tshuaj tiv thaiv REDOX uas tsis yog-spontaneous".
Cov khoom kho saum npoo tuaj yeem yog hlau (xws li hlau) lossis tsis yog hlau (xws li yas).
Hom kev kho deg:
Plating, Electroplating, Auto-catalytic Plating, Chemical Plating, Electroless Plating, Electroless Plating, Anodizing, Chemical Conversion Txheej, Blackening, Phosphating, Chromating, Hlau Colouring, Paint Finish, Kub dip (Galvanizing, Tinning), Physical Vacation Ion Plating, Tshuaj Vapor Deposition...
Cov txheej txheem ntawm electroplating:
Pretreatment:
Ua ntej plating, qhov saum npoo ntawm plating, xws li roj lossis hmoov av yuav tsum tau ntxuav kom zoo. Cov theem ua ntej kev kho mob feem ntau suav nrog kev siv ua ntej alkaline descaling, hluav taws xob descaling thiab pickling kom tshem tawm rind thiab xeb, thiab lwm yam kev ua kom nto. Cov txheej txheem ua ntej kev kho tus kheej yog tsim raws li hom plating thiab cov txheej txheem tom ntej plating. Tsis tas li ntawd, qee qhov chaw plating xws li txhuas, stainless hlau lossis ABS kua nplaum yuav tsum tau kho tshwj xeeb.
Kub-dip degreasing:
Nws yog feem ntau yog siv cov alkali thiab saponification ntawm saponification roj kom tshem tawm cov hlau nto av thiab oxides, uas yuav tsum muaj wetting, nkag mus, dispersion thiab emulsification cuam tshuam.
Feem ntau siv cov tshuaj: sodium hydroxide, sodium carbonate, sodium bicarbonate, sodium phosphate, trisodium phosphate, sodium pyrophosphate, gluconate thiab silicate, thiab lwm yam. Txawm li cas los xij, vim muaj teeb meem ib puag ncig, phosphate system yuav maj mam tshem tawm. Nws tsuas yog siv lub zog alkaline los siv rau cov substrates sib txawv.
Lub npe hu ua interface active agent yog emulsifier, tuaj yeem muab faib ua cationic, anionic, cationic thiab non-ionic interface active agent. Nws yuav tsum muaj cov nyhuv dispersion thiab emulsification, zam cov roj ntab ntawm qhov chaw kho, txo qhov kev tshem tawm, thiab txo cov teeb meem ntawm kev ntxuav tom ntej.
Electrolytic degreasing:
Vim yog electrolysis, lub cathode tsim hydrogen kom txo cov hlau (stainless steel phaj), thiab cov anode tsim oxygen thiab oxidizes av (qhov chaw); Gas tsav qhov kev ua kom nplawm thiab tshem tawm cov av. Lub luag haujlwm ntawm lye yog saponify roj. Txawm li cas los xij, cathode tuaj yeem tsim cov khoom siv hydrogenation, qhov sib txawv tam sim no ua rau muaj qhov sib txawv degreasing, thiab cov pa roj thiab kua pos huab tsim tib lub sijhawm ua rau muaj kev phom sij rau pej xeem thiab kev phom sij tawg, uas yuav tsum tau xav txog thaum siv.
Tam sim no, kub-dip degreasing thiab electrolytic degreasing yog siv ua ke. Qhov zoo ntawm electroplating yog zoo lossis phem, 50% nyob ntawm kev kho ua ntej.
Qhib qhib:
General substrate activation tseem hu ua pickling, acid neutralization lossis etching, nyob ntawm seb cov khoom thiab cov khoom raug kho. Nws tuaj yeem tshem tawm cov oxide thiab ntsev ntawm cov hlau saum npoo, kom cov hlau ntog yooj yim kaw nrog cov hlau electroplating tom ntej. Txawm li cas los xij, nws yuav tsum ua tib zoo xaiv qhov tsim nyog acid thiab corrosion inhibitor kom tsis txhob muaj kev yaig ntau dhau ntawm cov substrate, uas ua rau muaj teeb meem tom qab electroplating.
Electroplate:
Electroplating yog txheej txheem ntawm kev tso ib txheej nyias ntawm cov hlau rau saum npoo ntawm tus neeg xyuas pib los kho cov plating lossis tiv thaiv xeb. Cov hlau electroplating hauv Hong Kong muaj xws li npib tsib xee, tooj liab, tooj dag, chromium, zinc, nyiaj thiab kub. Ntxiv nrog rau electroplating, kev kho cov hlau feem ntau yog electroplating, anodizing thiab painting.
Tooj plating:
Feem ntau hauv da dej cyanide, sulfuric acid da dej thiab pyrophosphoric acid da dej. Cyanide da dej yog tsim rau hlau thiab zinc alloy substrate plating. Nrog tus neeg saib xyuas gloss tsim nyog, cov txheej txheem du gloss tuaj yeem tau txais. Cov txheej txheej yog qhov zoo, cov txheej txheem plating ruaj khov tau siv ntau xyoo, tab sis cov txheej txheem plating muaj ntau cov cyanide siab toxicity, siab nqi kho dej khib nyiab, ntxiv rau yob plating thiab pre-plating tau maj mam hloov.
Sulfuric acid da dej nrog cov additives tsim nyog, siab filling thiab gloss, tsis tshua muaj nqi, yooj yim tswj, tsis tshua muaj nqi kho dej khib nyiab, tau dav siv nyob rau hauv Circuit Court boards, decorations, electroforming thiab lwm yam teb.
Pyrophosphoric acid da dej nrog tsim nyog additives. Siv nyob rau hauv Circuit Court boards. Txawm li cas los xij, kev kho dej khib nyiab yog teeb meem, ntxiv rau zinc alloy hauv qab plating, yuav tsum tau hloov los ntawm sulfuric acid da dej.
Nickel plating:
Feem ntau sulfuric acid da dej, Vaz da dej ua nws tus neeg sawv cev, tus nqi qis ntawm cov tshuaj plating, kev tswj tau yooj yim, siv dav hauv ntau hom kev lag luam thiab cov khoom siv kho kom zoo nkauj, rau cov khoom siv hluav taws xob thiab cov khoom siv electroforming, sulfenic acid da dej nrog kev ntxhov siab, siab ductility, zoo sealing. thiab siab concentration formula, muaj ib nrab hloov sulfuric acid da dej.
Cov khoom ntawm gloss thiab flatness ntawm npib tsib xee txheej feem ntau yog nyob ntawm nickel additives.
General nickel plating additives tuaj yeem muab faib ua BRIGHTENER, CARRIER thiab WETTING tus neeg saib xyuas. Qhov zaus thiab tus nqi ntawm cov kua ntxiv yog nyob ntawm qhov roughness ntawm lub substrate, qhov xav tau thickness, thiab qhov yuav tsum tau gloss thiab flatness. Cov tshuaj plating yuav tsum tau soj ntsuam thiab ntxiv tsis tu ncua kom tswj tau qhov zoo ntawm txhua yam hauv cov tshuaj plating kom tswj tau qhov zoo ntawm txheej.
Gild:
Feem ntau hauv cyanide da dej, muab faib ua alkaline, nruab nrab thiab acidic. Ntxiv nrog rau cov kub ions (feem ntau hu ua kub ntsev), cov tshuaj plating yuav tsum muaj cov ntsev conductive, sib npaug ntawm cov ntsev ntsev (tsis ntsev), tus neeg sawv cev gloss; Tsis tas li ntawd, tus neeg sawv cev gloss tuaj yeem muab faib ua cov organic thiab alloy additives.
Kub ntsev: kub cyanide poov tshuaj, los muab ib qho ntxiv rau kub nag lossis daus, yog li thaum kub-plated, lub anode feem ntau yog blunt anode.
Conductive ntsev: muab cov nyhuv conductive hauv cov tshuaj plating.
Balanced conductive ntsev: muab cov kua qaub-puag sib npaug hauv da dej, cov nyhuv conductive.
Gloss agent (organic): muab gloss thiab flatness.
Gloss agent (alloy): muab cov xim hloov, hardness rau kev siv.
Lub homogeneity ntawm alkaline da dej yog qhov zoo, thiab nws tsis yooj yim rau eutectoid nrog hlau zoo li impurity. Cov da dej nruab nrab tuaj yeem ua eutectosed los ua cov txheej txheem alloy. Acid da dej kuj tuaj yeem tsim cov txheej txheej hlau, tuab plating, nrog cov khoom sib khi zoo dua, hardness thiab hnav tsis kam yog zoo heev, tshwj xeeb tshaj yog tsim rau cov khoom siv hluav taws xob.
Postprocessing:
Lub luag haujlwm tseem ceeb ntawm kev kho tom qab yog kom qhuav cov plating thiab ua qhov kev tshuaj ntsuam zaum kawg. Qee zaum, lub workpiece yuav tsum tau hloov pauv lossis pleev xim tom qab electroplating los muab cov txheej txheem tiv thaiv.
Kev kho zaj duab xis kuj yog ib qho kev xaiv kom cov txheej tiv thaiv kom tsis txhob muaj xim thiab yaig los ntawm ib puag ncig muaj kuab lom. Txawm li cas los xij, yuav tsum tau saib xyuas kom tsis txhob muaj teeb meem hauv kev kho mob tom ntej. Ntau qhov kev ua tiav tom qab, yuav tsum tau txais cov tshuaj tsuag ntsev, kua qaub, kub thiab lwm yam kev ntsuam xyuas, tshwj xeeb tshaj yog cov khoom siv hlau muaj txiaj ntsig, qhov yuav tsum tau ua kom nruj.
Ntxuav:
Kev ntxuav yog cov txheej txheem dej ntau tshaj plaws hauv cov khoom siv electroplating. Tom qab txhua lub tank plating, feem ntau muaj cov txheej txheem ntxuav kom tsis txhob plating qhov chaw los ntawm kev nqa cov kua seem mus rau lwm cov txheej txheem thiab ua rau muaj kab mob.
