He aha ka electroplating?
Ma nā ʻōlelo maʻalahi, pili ka electroplating i ka hopena electrolytic i loko o kahi hopena me ke kōkua ʻana o ke au pololei o waho e waiho i kahi metala a i ʻole ka ʻāpana alloy ma ka ʻili o kahi conductor e like me ke metala.
ʻO ka mea i kapa ʻia ka hopena electrolytic e pili ana i "ka hoʻohana ʻana i ka manawa i hoʻohālikelike ʻia e hana i ka hopena REDOX non-spontaneous".
Hiki ke metala (e like me ke kila) a i ʻole metala ʻole (e like me ka plastic).
Nā ʻano o ka mālama ʻana i luna:
Plating, Electroplating, Auto-catalytic Plating, Chemical Plating, Electroless Plating, Electroless Plating, Anodizing, Chemical Conversion Coating, Blackening, Phosphating, Chromating, Kalai Metala, Pena Hoʻopau, Hot dip（Galvanizing，Tinning）Vum ，Physphating ，Ion Pāʻani
Nā hana o ka electroplating:
Hana mua:
Ma mua o ka hoʻopaʻa ʻana, pono e hoʻomaʻemaʻe pono ʻia ka ʻili o ka plating, e like me ka momona a i ʻole ka lepo. Hoʻokomo pinepine ʻia ka papa hana mua i ka hoʻohana ʻana i ka descaling alkaline mua, ka descaling uila a me ka pickling no ka wehe ʻana i ka ʻili a me ka ʻōpala, a me nā ʻano hana ʻē aʻe. Hoʻolālā ʻia ke kaʻina hana mua o kēlā me kēia e like me ke ʻano o ka plating a me ke kaʻina hana plating ma hope. Eia kekahi, ʻo kekahi mau ʻāpana plating e like me ka aluminika, ke kila kila a i ʻole ke kāpili ABS e koi i kahi pretreatment kūikawā.
Hoʻomaʻemaʻe wela:
ʻO ka mea nui ka hoʻohana ʻana i ka alkali a me ka saponification o ka aila saponification e wehe i ka lepo metala a me nā oxides, pono e loaʻa i ka wetting, penetration, dispersion a me nā hopena emulsification.
ʻO nā mea hana maʻamau: sodium hydroxide, sodium carbonate, sodium bicarbonate, sodium phosphate, trisodium phosphate, sodium pyrophosphate, gluconate a silicate, a me nā mea'ē aʻe, ma muli o nā pilikia o ke kaiapuni, e hoʻopau mālieʻia ka pūnaewele phosphate. Hoʻohana nui ia i ka ikaika alkaline e hoʻopili i nā substrate like ʻole.
ʻO ka mea i kapa ʻia ʻo interface active agent ka emulsifier, hiki ke māhele ʻia i cationic, anionic, cationic a me ka non-ionic interface active agent. Pono ia i ka hopena o ka hoʻopuehu a me ka emulsification, e pale i ka ʻaila e lana ana ma luna o ka ʻili i mālama ʻia, e hoʻemi i ka wehe ʻana, a hoʻemi i ka pilikia o ka holoi ʻana ma hope.
Electrolytic degreasing:
Ma muli o ka electrolysis, hoʻopuka ka cathode i ka hydrogen e hōʻemi i ka metala (stainless steel plate), a hoʻopuka ka anode i ka oxygen a hoʻoneʻe i ka lepo (mau ʻāpana); Hoʻokuʻu ke kinoea i ka hana hoʻoulu a wehe i ka lepo. ʻO ka hana o ka lye ka hoʻomaʻamaʻa ʻana i ka ʻaila. Eia nō naʻe, hiki i ka cathode ke hana i ka hydrogenation waiwai, ʻo ka deviation o kēia manawa e hana i nā hopena degreasing like ʻole, a ʻo ke kinoea a me ka noe wai i hana ʻia i ka manawa like e hoʻopilikia i ka lehulehu a me nā pōʻino pahū, pono e noʻonoʻo ʻia i ka wā e hoʻohana ai.
I kēia manawa, hoʻohana pū ʻia ka hoʻoheheʻe ʻana i ka wela a me ka electrolytic degreasing. He maikaʻi a maikaʻi ʻole paha ka maikaʻi o ka electroplating, 50% e pili ana i ka hana mua.
Ho'ā:
ʻIke ʻia ka hoʻoulu ʻana o ka substrate ma ke ʻano he pickling, neutralization acid a i ʻole etching, ma muli o ka huahana a me nā mea i mālama ʻia. Hiki iā ia ke wehe i ka oxide a me ka paʻakai ma ka ʻili metala, i maʻalahi ke pani ʻana o ka ʻili metala me ka metala electroplating e hiki mai ana. Eia naʻe, pono e koho pono i ka waika kūpono a me ka corrosion inhibitor e pale aku i ka nui o ka erosion o ka substrate, ka hopena i nā pilikia electroplating ma hope.
Electroplating:
ʻO ka electroplating ke kaʻina hana o ka waiho ʻana i kahi ʻāpana lahilahi o ka metala ma luna o ka ʻili o ka conductor e hoʻonani i ka plating a pale paha i ka ʻōpala. ʻO ka hoʻopalapala metala maʻamau ma Hong Kong e pili ana i ka nickel, keleawe, keleawe, chromium, zinc, kala a me ke gula. Ma waho aʻe o ka electroplating, ʻo ka mālama ʻana i ka metala maʻamau ka electroplating, anodizing a me ka pena.
Ka uhi keleawe:
ʻO ka mea nui i ka ʻauʻau cyanide, ʻauʻau sulfuric acid a me ka wai ʻauʻau pyrophosphoric. He kūpono ka ʻauʻau cyanide no ka hao a me ka zinc alloy substrate plating. Me ka mea hoʻonani maikaʻi, hiki ke loaʻa i ka uhi ʻoluʻolu. He maikaʻi ke ʻano o ka uhi ʻana, ua hoʻohana ʻia ka paʻa o ka plating solution no nā makahiki he nui, akā ʻo ka plating solution ka nui o ka cyanide high toxicity, ke kumukūʻai kiʻekiʻe o ka hoʻomaʻamaʻa ʻana i ka wai, me ka hoʻohui ʻana i ka plating roll a me ka pre-plating ua hoʻololi mālie ʻia.
ʻO ka waiʻauʻau Sulfuric me nā mea hoʻohui kūpono, kiʻekiʻe ka hoʻopiha a me ka nani, ke kumukūʻai haʻahaʻa, ka hoʻokele maʻalahi, ke kumu kūʻai haʻahaʻa o ka mālama ʻana i ka wai, ua hoʻohana nui ʻia i nā papa kaapuni, nā mea hoʻonaninani, electroforming a me nā kahua ʻē aʻe.
Pyrophosphoric acid bath me nā mea hoʻohui kūpono. Hoʻohana ʻia i nā papa kaapuni. Eia naʻe, pilikia ka mālama ʻana i ka wai ʻino, ma kahi o ka zinc alloy lalo plating, e pani ʻia e ka ʻauʻau sulfuric acid.
ʻO ka pā nikela:
ʻO ka mea nui sulfuric acid bath, Vaz bath ma ke ʻano he ʻelele, haʻahaʻa haʻahaʻa o ka plating solution, hoʻokele maʻalahi, hoʻohana nui ʻia i nā ʻano ʻenehana a me nā mea hoʻonaninani, no nā ʻāpana uila a me nā koi electroforming, ʻauʻau sulfenic acid me ka haʻahaʻa haʻahaʻa, kiʻekiʻe ductility, ʻoi aku ka maikaʻi. a me kiʻekiʻe hoʻonaʻauao kumu, ua hoʻololi hapa sulfuric waiʻauʻauʻauʻau.
ʻO nā waiwai o ka nani a me ka palahalaha o ka nickel coating e hilinaʻi nui ʻia i nā mea hoʻohui nickel.
Hiki ke hoʻokaʻawale ʻia nā mea hoʻohui nickel plating maʻamau i BRIGHTENER, CARRIER a me WETTING agent. ʻO ke alapine a me ka nui o ka wai i hoʻohui ʻia e pili ana i ka ʻala o ka substrate, ka mānoanoa i makemake ʻia, a me ka nani a me ka palahalaha. Pono ke kālailai a hoʻonui pinepine ʻia ka hopena plating no ka mālama ʻana i ka manaʻo maikaʻi o kēlā me kēia ʻāpana i ka hopena plating e mālama i ka maikaʻi o ka uhi.
Gild:
ʻO ka mea nui i ka ʻauʻau cyanide, māhele ʻia i ka alkaline, neutral a me ka acidic. Ma waho aʻe o nā iona gula (ʻike mau ʻia ʻo ka paʻakai gula), pono e loaʻa i ka solution plating ka paʻakai conductive, ka paʻakai conductive kaulike (paʻakai paʻakai), ka mea hoʻonani; Eia kekahi, hiki ke hoʻokaʻawale ʻia ka mea gloss i nā mea hoʻohui a me nā mea hoʻohui.
ʻO ka paʻakai gula: gula cyanide potassium, e hāʻawi i mea hoʻohui no ka ua gula, no laila ke uhi ʻia ke gula, he anode blunt ka anode.
ʻO ka paʻakai paʻakai: hāʻawi i ka hopena conductive i ka hopena plating.
ʻO ka paʻakai conductive kaulike: e hāʻawi i ke koena acid-base i ka ʻauʻau, hopena conductive.
Mea hoʻonani (organic): e hāʻawi i ka nani a me ka palahalaha.
Mea hoʻonani (alloy): hāʻawi i ka hoʻololi kala, paʻakikī no ka hoʻohana.
He maikaʻi ka homogeneity o ka ʻauʻau alkaline, a ʻaʻole maʻalahi e eutectoid me ka haumia metala. Hiki ke eutectosed ka ʻauʻau kuʻuna e hana i ka uhi ʻana. Hiki i ka wai ʻauʻau ke hana i ka uhi ʻana i ka alloy, ka uhi mānoanoa, me ka waiwai hoʻopaʻa ʻoi aku ka maikaʻi, ʻoi aku ka paʻakikī a me ke kūpaʻa ʻana, kūpono loa no nā ʻāpana uila.
Hoʻoponopono hope:
ʻO ka hana nui o ka mālama ʻana ma hope o ka hoʻomaloʻo ʻana i ka plating a hana i kahi nānā hope. I kekahi mau hihia, pono e hoʻololi a pena ʻia ka mea hana ma hope o ka electroplating e hāʻawi i kahi pale pale.
ʻO ka hoʻomaʻamaʻa kiʻiʻoniʻoni kekahi koho no ka mālama ʻana i ka pale pale i ka discoloration a me ka erosion mai ka pollution kaiapuni. Eia naʻe, pono e mālama ʻia e pale aku i nā pilikia i ka mālama ʻana ma hope. ʻO ka nui ma hope o ka hoʻoponopono ʻana, pono e ʻae i ka paʻakai paʻakai, acid base, kiʻekiʻe wela a me nā hoʻokolohua ʻē aʻe, ʻoi aku ka nui o nā huahana metala makamae, ʻoi aku ka ikaika o nā koi.
Hoʻomaʻemaʻe:
ʻO ka hoʻomaʻemaʻe ke kaʻina hana wai-nui loa i ka hana electroplating. Ma hope o kēlā me kēia pahu hoʻoheheʻe, loaʻa nā kaʻina holoi holoi e pale aku i nā ʻāpana plating mai ka lawe ʻana i ke koena wai i nā kaʻina hana ʻē aʻe a hoʻopōʻino.
